Carrier: FOUP (Comply with SEMI E47.1(25 wafers))
Inter Face: 5 Carrier stage (Continuous flow operation)with Semi compliant MENV and FIMS assemblies.

Hardware Configurration
Proc Chbr 1,2,3,4: SCCM Oxide; Y2O3 Coating
Chamber hardware: FCC
Endpoint type: SE2000ii
ESC type: Ceramics ESC with STD Vpp
Focus ring: 3.4mm
Thunderwall He Gas Inlet: Ceramic Thunderwall with Ceramic pusher pins
Polished focus ring: O
FC lower insulator: FC lower insulator w/quartz upper ring shield

TMP: TMP-3403LMC-T4(VG300) (SHIMADZU)
TMP Back Pressure Monitor: 51A11TGA2BA003
(MKS)ESR80WN, KEG approved
Final Valve, Heater: Valve; AGD21V-6RM-GWL4(CKD)
Dry Pump: ESR80WN, KEG approved
APC: Pendulum Motion Dia., 320mm(VAT), R.T.~90deg
Pressure Monitor: C/M (Process Monitor): 627BRETDD2P (MKS)